Zarlink Semiconductor MT8870DS

Integrated DTMF Receiver

Part Number

MT8870DS

Footprint 0 Description

SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Medium Density

Manufacturer

Zarlink Semiconductor

Footprint 2 Description

SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Low Density

Description

Integrated DTMF Receiver

Packagedescription

18-Pin Small Outline Integrated Circuit 1.27 mm Pitch

Prefix

Manufacturer Link

http://products.zarlink.com